Bamberg Lennart <br/><br/>
3D interconnect architectures for heterogeneous technologies 

 - New York  Springer  2022 
<br/><br/><label>ISBN: </label>9783030982294 
<br/><br/><label>Subjects--Topical Terms: </label><br/>ETC
<br/><br/><label>Dewey Class. No.: </label>621.3815